• DocumentCode
    545683
  • Title

    Introduction to latest RF test technologies in RF ATE for low test cost and high throughput

  • Author

    Kimishima, M.

  • Author_Institution
    ADVANTEST Corp., Gunma, Japan
  • fYear
    2011
  • fDate
    20-22 April 2011
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    This paper describes latest RF ATE (Automated Test Equipments) technologies including DUT (Device under Test) connections, calibration method as well as RF test module. A major interest of RF test is cost of test (COT). Most important respect for low COT is how achieve a number of simultaneous measurements and short test time. We realized the both respects by drastically downsized RF test module with multiple resources and high throughput. The module is installed in our RF ATE systems, and contributes for reducing COT. To improve efficiency of simultaneous measurements, RF calibration and DUT board are also very important. Major contribution for downsizing of the RF test module is RF circuit technology in form of RF functional system in package (RF-SIPs).
  • Keywords
    automatic test equipment; calibration; costing; integrated circuit testing; radiofrequency integrated circuits; system-in-package; RF ATE; RF circuit technology; RF functional system in package; RF test module; RF test technology; automated test equipments technologies; calibration method; cost of test; device under test connections; high throughput; low test cost; Calibration; Correlation; Radio frequency; Sockets; Testing; Throughput; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference Proceedings (CJMW), 2011 China-Japan Joint
  • Conference_Location
    Hangzhou
  • Print_ISBN
    978-1-4577-0625-7
  • Electronic_ISBN
    978-7-308-08555-7
  • Type

    conf

  • Filename
    5773938