DocumentCode
547342
Title
Quantitative safety analysis of a kind of embedded software
Author
Wang, Hongpo ; Zhou, Hongjian ; Wang, Honglei
Author_Institution
China Aeronaut. Comput. Tech. Res. Inst. Army, Xian, China
Volume
3
fYear
2011
fDate
10-12 June 2011
Firstpage
391
Lastpage
396
Abstract
The safety analysis process of a kind of signal indicating embedded software is shown in this paper. A quantitative method is presented to model and evaluate software safety. The basic theory frame of Finite State Machine (FSM), Markovian theory and definition of gray entropy are presented. FSM safety model of the embedded software is built. 1-step transition probability matrixes are constructed referencing transition probability matrix concept of Markovian theory. After that, the safety of the software and the whole embedded system are discussed in detail. The analysis indicates that improving safety of the software and system is a complicated work. Hardware, algorithms and training of the operators etc. are the aspects that need to be carefully regarded. It also shows the way to accurately measure the safety of the software. The analyzing results of the software are extended to a general situation. The safety of software is predicted by using 1-step transition probability matrixes. Finally, numerical calculation is applied to validate the above analysis.
Keywords
Markov processes; embedded systems; finite state machines; matrix algebra; probability; safety-critical software; 1-step transition probability matrixes; FSM safety model; Markovian theory; embedded system; finite state machine; gray entropy; numerical calculation; quantitative method; quantitative safety analysis; referencing transition probability matrix concept; safety analysis process; signal indicating embedded software; software safety; theory frame; Finite State Machine; Markovian theory; embedded software; gray entropy; quantitative safety analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Science and Automation Engineering (CSAE), 2011 IEEE International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-8727-1
Type
conf
DOI
10.1109/CSAE.2011.5952704
Filename
5952704
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