DocumentCode
548585
Title
Diagnostic of microplasma reactor for scanning plasma etching
Author
Wang, H. ; Tong, Y.H. ; Wen, L. ; Li, Z.
Author_Institution
Sch. of Mech. & Automotive Eng., Anhui Polytech. Univ., Wuhu, China
fYear
2011
fDate
5-9 June 2011
Firstpage
1606
Lastpage
1609
Abstract
We report electrical properties and Optical Emission Spectrum of DC-Driven Microplasma Reactor for Scanning Plasma Etching in pure SF6 environment with different device size between 5-12 kPa gas pressures. The Microplasma Reactor is consists of metal-insulator-metal sandwich structure, and with an inverted pyramidal shape hollow cathode. A diagnostic system is design to measure the V-I curve and OES (optical emission spectrum) of the microplasma. The result shows that the discharge current is increased with the gas pressure and applied voltage, the density of the active silicon etchant F atom emission spectrum line is increased with the decrease of the device size. These results confirm that the Microplasma Reactor is suitable for Scanning Plasma Etching of silicon.
Keywords
MIM structures; glow discharges; plasma devices; plasma diagnostics; plasma materials processing; plasma pressure; sputter etching; DC-driven microplasma reactor; SF6 environment; V-I curve measurement; discharge current; inverted pyramidal shape hollow cathode; metal-insulator-metal sandwich structure; microplasma reactor diagnostic; optical emission spectrum; pressure 5 kPa to 12 kPa; scanning plasma etching; Cathodes; Discharges; Etching; Inductors; Plasmas; Stimulated emission; Sulfur hexafluoride; Microplasma Reactor; Optical Emission Spectrum; Scanning Plasma Etching; V–I curve;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location
Beijing
ISSN
Pending
Print_ISBN
978-1-4577-0157-3
Type
conf
DOI
10.1109/TRANSDUCERS.2011.5969801
Filename
5969801
Link To Document