Title :
Metamorphic and non-conventional ‘buffer’ layers
Author :
Kuech, T.F. ; Jha, S. ; Wiedmann, M.K. ; Paulson, C.A. ; Babcock, S.E. ; Kuan, T.S. ; Mawst, L.J. ; Kirch, J. ; Kim, Tae Wan
Author_Institution :
Dept. of Chem. & Biol. Eng., Univ. of Wisconsin - Madison, Madison, WI, USA
Abstract :
The integration of large lattice mismatch materials through epitaxial growth requires the introduction of a controlled interface or transitional region, often referred to as a buffer layer. These, often relatively thick, transitional layers allow for a change in lattice parameter and a reduction in the threading dislocation density attributed to the required mismatch dislocations in the strain-relaxed materials. New designs for these transitional layers are emerging which allow for a reduction in buffer layer thickness, smoother morphology, and lower threading dislocation densities. These metamorphic buffer layers allowed the development of devices accessing new ranges of performance and, in the case of optical devices, wavelength regimes. The reduction of the buffer layer to a `single interface´ may be possible through the use of nano-patterning and advanced processing which provides control over the initial phases of nucleation and strain relaxation.
Keywords :
III-V semiconductors; buffer layers; dislocation density; epitaxial growth; indium compounds; lattice constants; semiconductor epitaxial layers; semiconductor growth; InAsxP1-x; InP; buffer layer thickness; controlled interface; epitaxial growth; initial phases; large lattice mismatch materials; lattice parameter; metamorphic buffer layer; mismatch dislocations; nanopatterning; nucleation; optical devices; single interface; strain relaxation; strain-relaxed materials; threading dislocation density; transitional layers; transitional region; wavelength regimes; Buffer layers; Rough surfaces; Substrates; Surface morphology; Surface roughness; III–V semiconductors; defects; optical devices;
Conference_Titel :
Compound Semiconductor Week (CSW/IPRM), 2011 and 23rd International Conference on Indium Phosphide and Related Materials
Conference_Location :
Berlin
Print_ISBN :
978-1-4577-1753-6
Electronic_ISBN :
978-3-8007-3356-9