Title :
3D integration for energy efficient system design
Author_Institution :
Intel Corp., Hillsboro, OR, USA
Abstract :
Technology scaling will continue, doubling transistor integration capacity every two years, providing billions of transistors to enable novel systems. 3D integration technology will open the doors even further, changing the landscape, allowing heterogeneous integration of diverse technologies, with abundance of energy efficient interconnects to realize affordable complex systems that will continue to deliver higher performance. This paper presents how to exploit this new technology for energy efficient system designs.
Keywords :
integrated circuit design; three-dimensional integrated circuits; transistors; 3D integration technology; energy efficient system design; technology scaling treadmill; transistor integration capacity; Bandwidth; Memory management; Random access memory; Three dimensional displays; Through-silicon vias; Tiles; Transistors; 3D; Automation; Performance; Power;
Conference_Titel :
Design Automation Conference (DAC), 2011 48th ACM/EDAC/IEEE
Conference_Location :
New York, NY
Print_ISBN :
978-1-4503-0636-2
