DocumentCode :
549692
Title :
High thermal robust ReRAM with a new method for suppressing read disturb
Author :
Terai, M. ; Saitoh, M. ; Nagumo, T. ; Sakotsubo, Y. ; Yabe, Y. ; Takeda, K. ; Hase, T.
Author_Institution :
LSI Res. Lab., Renesas Electron. Corp., Sagamihara, Japan
fYear :
2011
fDate :
14-16 June 2011
Firstpage :
50
Lastpage :
51
Abstract :
A thermal robust ReRAM (Resistive RAM) with a new method for suppressing read disturb was investigated. The switching property and `on´ resistance were scarcely varied by the operation temperature up to 200°C. Asymmetric structure such as Ru/TiO2/Ta2O5/TiO2/W showed `off´ switching only when a positive voltage was applied on the Ru electrode. The `reverse bias´ read operation, applying the positive voltage to the W electrode of asymmetric structure, could much improved the read disturb immunity. It was also confirmed that the ReRAM could be scaled keeping its resistive properties to 28-nm node. Additionally, low switching voltage less than 3 V, low `off´ switching current of 25μA, and high speed read less than 10 nsec were achieved simultaneously. These excellent properties are desirable for the automobile application.
Keywords :
automotive electronics; random-access storage; asymmetric structure; automobile application; current 25 muA; high-thermal robust ReRAM; read disturb immunity; read disturb suppression; resistive RAM; reverse bias read operation; size 28 nm; switching property; Electrodes; Resistance; Robustness; Switches; Temperature; Tin; ReRAM; Ta2O5; TiO2; reverse bias read;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology (VLSIT), 2011 Symposium on
Conference_Location :
Honolulu, HI
ISSN :
0743-1562
Print_ISBN :
978-1-4244-9949-6
Type :
conf
Filename :
5984627
Link To Document :
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