DocumentCode :
55088
Title :
Analytical and Finite-Element Modeling of a Two-Contact Circular Test Structure for Specific Contact Resistivity
Author :
Pan, Yongping ; Reeves, Geoffrey K. ; Leech, Patrick W. ; Holland, Anthony S.
Author_Institution :
Sch. of Electr. & Comput. Eng., R. Melbourne Inst. of Technol., Melbourne, VIC, Australia
Volume :
60
Issue :
3
fYear :
2013
fDate :
Mar-13
Firstpage :
1202
Lastpage :
1207
Abstract :
The specific contact resistivity of a metal-semiconductor ohmic contact can be determined using a number of different test structures, and several of these use the transmission line model approach. In the circular transmission line model test structure, the concentric circular contacts have circular equipotentials in the semiconductor layer, and transmission line model equations can be used to describe their current-voltage behavior. Using test structures with two circular contacts of three different sizes, we present a new technique for determining specific contact resistivity. The analytical expressions are developed and presented, and finite-element modeling results are undertaken to demonstrate the accuracy of the technique. The scaling behavior of this test structure is also discussed. There are no error corrections required for determining contact parameters using the presented test structure.
Keywords :
contact resistance; finite element analysis; ohmic contacts; semiconductor-metal boundaries; transmission line theory; circular equipotentials; circular-transmission line model test structure; concentric circular contacts; current-voltage behavior; finite element modeling; metal-semiconductor ohmic contact; scaling behavior; semiconductor layer; specific contact resistivity; transmission line model equation; two-contact circular test structure; Conductivity; Contact resistance; Electrodes; Finite element methods; Ohmic contacts; Resistance; Semiconductor device modeling; Contact resistance; ohmic contact; specific contact resistivity;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2013.2242076
Filename :
6461397
Link To Document :
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