DocumentCode
554412
Title
Research on influence of return oil groove width on temperature field of hydrostatic thrust bearing with multiple oil pads
Author
Xiaoqiu Xu ; Junpeng Shao ; Yunfei Wang ; Chunxi Dai ; Xiaodong Yang ; Yanqin Zhang ; Bo Wu
Author_Institution
Harbin Univ. of Sci. & Technol., Harbin, China
Volume
2
fYear
2011
fDate
12-14 Aug. 2011
Firstpage
940
Lastpage
943
Abstract
Based on lubrication theory and computational fluid dynamics, build finite element model of lubricating oil film of hydrostatic bearing with multiple oil pads, carry on analysis calculation for temperature field of hydrostatic bearing with multiple oil pads adopting finite volume method. Under variable viscosity, aiming at different return oil groove width on the premise of the same depth, carry on numerical simulation for oil film of hydrostatic bearing with multiple oil pads, using general fluid finite element software CFX, and discuss the influence of return oil groove width on temperature rise when hydrostatic bearing with multiple oil pads work at a constant speed under constant inlet flow rate, analysis results indicate that distribution law of three-dimensional temperature field of oil film basically is identical under different return oil groove width, temperature rise of hydrostatic bearing with multiple oil pads is little affected by return oil groove width.
Keywords
computational fluid dynamics; finite element analysis; finite volume methods; hydraulic fluids; hydrostatics; lubricating oils; machine bearings; temperature distribution; computational fluid dynamics; finite element model; finite volume method; fluid finite element software CFX; hydrostatic thrust bearing; lubricating oil fdm; lubrication theory; multiple oil pads; numerical simulation; return oil groove width; temperature field distribution; temperature rise; viscosity; Films; Finite element methods; Friction; Lubrication; Temperature distribution; Viscosity; finite volume method; hydrostatic bearing; multiple oil pads; return oil groove;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic and Mechanical Engineering and Information Technology (EMEIT), 2011 International Conference on
Conference_Location
Harbin, Heilongjiang, China
Print_ISBN
978-1-61284-087-1
Type
conf
DOI
10.1109/EMEIT.2011.6023249
Filename
6023249
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