• DocumentCode
    554489
  • Title

    Finite element simulation of SPF/DB process for ZK60 magnesium alloy corrugated part

  • Author

    Yandong Yu ; Chao Li ; Juan Feng

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Harbin Univ. of Sci. & Technol., Harbin, China
  • Volume
    3
  • fYear
    2011
  • fDate
    12-14 Aug. 2011
  • Firstpage
    1654
  • Lastpage
    1657
  • Abstract
    Superplastic forming and diffusion boding (SPF/DB) technology has been considered as one of the advanced manufacturing methods. In this paper, SPF/DB process of magnesium alloy corrugated part was analyzed by FEM software (MARC) with three-dimensional finite element model. Penalty function method was applied to analyze the contact problem. The distribution of the wall-thickness and the deformation characteristic during the forming process were analyzed, and also, the location of the risky point was predicted by tracing the wall thickness and analyzing the friction between the die and the part. A ZK60 magnesium alloy corrugated part was produced successfully by SPF/DB, and the results of FEM simulation were in good agreement with that of the experiment. Meanwhile, it is observed that the cavities are growing with the increasing of the deformation amount, and the cavity size and percentage get maximum values (9μm and 7.7% respectively) at the corner region of the part, in which the wall-thickness decreases sharply and thereby leading to the fracture of the part.
  • Keywords
    diffusion bonding; finite element analysis; forming processes; fracture; magnesium alloys; production engineering computing; superplasticity; FEM simulation; FEM software; MARC; SPF-DB process; ZK60 magnesium alloy corrugated part; diffusion boding; finite element simulation; forming process; fracture; penalty function method; superplastic forming; three-dimensional finite element model; Cavity resonators; Finite element methods; Flanges; Magnesium; Plastics; SPF/DB; ZK60 magnesium alloy; cavity microstructure; finite element simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic and Mechanical Engineering and Information Technology (EMEIT), 2011 International Conference on
  • Conference_Location
    Harbin, Heilongjiang, China
  • Print_ISBN
    978-1-61284-087-1
  • Type

    conf

  • DOI
    10.1109/EMEIT.2011.6023373
  • Filename
    6023373