DocumentCode
554586
Title
Application of advnced process control on mixed-product chemical mechanical polishing process
Author
Chien-Feng Wu ; Cheng-Hsien Chen ; Mui-Home Chen ; Cheng-Wenc Chen
Author_Institution
Inst. of Electr. Control Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume
4
fYear
2011
fDate
12-14 Aug. 2011
Firstpage
2116
Lastpage
2119
Abstract
This research developed a run-to-run (RtR) process control technique on the mix-product chemical mechanical polishing (CMP) process. The model of the mix-product CMP process was constructed by using analysis of variance and time series analysis. Then, it was transferred to the state space Torm and the extended Kalman filter was employed to estimate the disturbances and update the tool parameter simultaneously. Different methods including time series analysis, double exponentially weighted moving average (D-EWMA), time variant D-EWMA and the proposed method was carried out by CMP real data and the results demonstrated that the performance or the proposed method is better than others.
Keywords
chemical mechanical polishing; process control; statistical analysis; time series; advanced process control; analysis of variance; double exponentially weighted moving average; extended Kalinan filter; mix-product CMP process; mixed-product chemical mechanical polishing process; run-to-run process control technique; time series analysis; Analysis of variance; Data models; Kalman filters; Mathematical model; Process control; Semiconductor process modeling; Time series analysis; analysis of variance; extended Kalman fitter; mix-product chemical mechanical polishing; time series analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic and Mechanical Engineering and Information Technology (EMEIT), 2011 International Conference on
Conference_Location
Harbin, Heilongjiang, China
Print_ISBN
978-1-61284-087-1
Type
conf
DOI
10.1109/EMEIT.2011.6023519
Filename
6023519
Link To Document