DocumentCode
554591
Title
Temperature field of the instrument for measuring the yield stress of magnetorheological fluid
Author
Zuzhi Tian ; Youfu Hou ; Nannan Wang
Author_Institution
Coll. of Mech. & Electr. Eng., China Univ. of Min. & Technol., Xuzhou, China
Volume
5
fYear
2011
fDate
12-14 Aug. 2011
Firstpage
2415
Lastpage
2418
Abstract
To obtain the temperature distribution of the instrument for measuring yield stress of magnetorheological fluid and the influence rule of deformation caused by temperature on the magnetic field between disks, on the basis of thermal conduction theory, the temperature field and deformation of disks is studied by the finite element method, the results indicate that the temperature increases along the radius, the highest temperature appears in the section near the edge of disk, the temperature difference is small and the value is 10°C; during the time of 300s, the temperature rises approximately linearly; the structural sizes of disks have an attractive influence on the temperature field, when the slip power is unchanged, the larger the thickness and radius of disk, the lower the average temperature; when the speed keeps constant, the larger the radius the disk, the higher the average temperature and the temperature difference; the deformation of disk is mainly caused by thermal expansion of material and the maximum deformation is 1.38×10-5 mm.
Keywords
deformation; discs (structures); finite element analysis; heat conduction; instruments; magnetohydrodynamics; magnetorheology; slip flow; temperature distribution; thermal expansion; yield stress; disk deformation analysis; finite element method; magnetorheological fluid; material thermal expansion; slip power analysis; temperature difference analysis; temperature distribution; temperature field; thermal conduction theory; yield stress measuring instrument; Fluids; Instruments; Magnetic fields; Stress; Temperature distribution; Temperature measurement; deformation; magnetorheological fluid; temperature field; yield stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic and Mechanical Engineering and Information Technology (EMEIT), 2011 International Conference on
Conference_Location
Harbin, Heilongjiang, China
Print_ISBN
978-1-61284-087-1
Type
conf
DOI
10.1109/EMEIT.2011.6023529
Filename
6023529
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