• DocumentCode
    556243
  • Title

    An approach to stiffness analysis methodology for haptic devices

  • Author

    Ahmad, Aftab ; Anderson, Kjell ; Sellgren, Ulf

  • Author_Institution
    Machine Design Dept., R. Inst. of Technol.-KTH, Stockholm, Sweden
  • fYear
    2011
  • fDate
    5-7 Oct. 2011
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    In this work a new methodology is proposed to model the static stiffness of a haptic device. This methodology can be used for other parallel, serial and hybrid manipulators. The stiffness model considers the stiffness of; actuation system; flexible links and passive joints. For the modeling of the passive joints a Hertzian contact model is introduced for both spherical and universal joints and a simply supported beam model for universal joints. For validation of the stiffness model a modified JP Merlet kinematic structure has been used as a test case. A parametric Ansys FEM model was developed for this test case and used to validate the resulting stiffness model. The findings in this paper can provide an additional index to use for multi-objective structural optimization to find an optimum compromise between a lightweight design and the stiffness performance for high precision motion within a larger workspace.
  • Keywords
    elasticity; finite element analysis; haptic interfaces; human-robot interaction; manipulator kinematics; optimisation; Hertzian contact model; JP Merlet kinematic structure; actuation system; flexible links; haptic devices; manipulators; multiobjective structural optimization; parametric Ansys FEM model; passive joints; simply supported beam model; spherical joints; static stiffness analysis methodology; universal joints; Equations; Force; Haptic interfaces; Joints; Kinematics; Mathematical model; Robots; Haptics; Parallel/Serial kinematic structures; stiffness methodology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultra Modern Telecommunications and Control Systems and Workshops (ICUMT), 2011 3rd International Congress on
  • Conference_Location
    Budapest
  • ISSN
    2157-0221
  • Print_ISBN
    978-1-4577-0682-0
  • Type

    conf

  • Filename
    6078947