• DocumentCode
    556356
  • Title

    Modeling of power devices with Drift Region Integrated Microchannel Cooler

  • Author

    Vladimirova, Kremena ; Avenas, Yvan ; Crebier, Jean-Christophe ; Schaeffer, Christian ; Lebouc, Fabien ; Tawk, Mansour

  • Author_Institution
    Grenoble Electr. Eng. Lab. (G2Elab), St. Martin d´´Hères, France
  • fYear
    2011
  • fDate
    27-29 Sept. 2011
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper introduces the DRIMCooler - an innovative concept allowing to locate the heat exchanger directly inside the active region of a vertical power device. Based on vertical edge termination technique and the use of dielectric coolant fluid circulation, arrays of through wafer channels are drilled in the silicon substrate offering a large heat exchange coefficient while minimizing the pressure drops. The concept is introduced and discussed with respect to technological and electrical points of view. Thermal and fluidic issues are analyzed with numerical models and simulations. The obtained results show excellent thermal and hydraulic performances of the DRIM Cooler.
  • Keywords
    coolants; cooling; fluidics; heat exchangers; hydraulic fluids; numerical analysis; power electronics; silicon; dielectric coolant fluid circulation; drift region integrated microchannel cooler; fluidic issue; heat exchanger; hydraulic performance; numerical simulation; power device modeling; silicon substrate; thermal issue; thermal performance; vertical edge termination technique; vertical power device; Coolants; Dielectrics; Fluids; Heat transfer; Heating; Metals;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems (THERMINIC), 2011 17th International Workshop on
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4577-0778-0
  • Type

    conf

  • Filename
    6081005