Enhanced package- and die-level defect localization by dynamic lock-in thermography

Author

Schlangen, R. ; Deslandes, H. ; Schussler, R. ; Lundquist, T. ; Reverdy, Antoine

Author_Institution

DCG Syst. Inc., Fremont, CA, USA

fYear

2011

fDate

27-29 Sept. 2011

Firstpage

1

Lastpage

5

Abstract

Recent improvements of microscopic Lock-In Thermography (LIT) offer the non-destructive localization of thermally active defects like shorts or resistive opens, even through the full package. This paper briefly discusses LIT based analysis flow highlighting benefits of the combination with 3D x-ray. The main focus of the paper is to discuss and demonstrate different ways how to activate the thermally active defects with more complex Devices Under Test (DUTs)/defect signatures, requiring Automated Test Equipment (ATE) docking.

Keywords

automatic test equipment; infrared imaging; integrated circuit testing; nondestructive testing; system-in-package; 3D X-ray; automated test equipment docking; defect signatures; devices under test; die-level defect localization; dynamic lock-in thermography; microscopic lock-in thermography; nondestructive localization; package-level defect localization; thermally active defects; Failure analysis; Heating; Power supplies; Real time systems; Thermal analysis; Three dimensional displays; Voltage measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Investigations of ICs and Systems (THERMINIC), 2011 17th International Workshop on

Conference_Location

Paris

Print_ISBN

978-1-4577-0778-0

Type

conf

Filename

6081020