• DocumentCode
    556386
  • Title

    Active control of circuit cooling conditions for transient thermal measurement purposes

  • Author

    Janicki, Marcin ; Kulesza, Zbigniew ; Torzewicz, Tomasz ; Napieralski, Andrzej

  • Author_Institution
    Dept. of Electron. & Comput. Sci., Tech. Univ. of Lodz, Lodz, Poland
  • fYear
    2011
  • fDate
    27-29 Sept. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents a practical realization of the circuit for the active control of cooling conditions for transient thermal measurements of a tested device or package with the dual cold plate cooling assembly equipped with Peltier thermoelectric modules. The operation of the realized control system is illustrated here based a practical example where the cooling conditions on both sides of a power diode package are actively adjusted so as to impose isothermal conditions independently from the amount of power dissipated in the device.
  • Keywords
    assembling; cooling; thermal analysis; thermal engineering; Peltier thermoelectric module; active control; circuit cooling condition; dual cold plate cooling assembly; isothermal condition; power diode package; transient thermal measurement; Cold plates; Current measurement; Temperature measurement; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems (THERMINIC), 2011 17th International Workshop on
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4577-0778-0
  • Type

    conf

  • Filename
    6081038