Title :
A 3-D super computer architecture
Abstract :
3D-IC will be the ultimate architecture of the IC design. When it leads to the 3D-Computer, no PCB no package no cable and even no connector are needed. It also has the benefit of small size light weight high speed and less power consumption to meet the global warming regulation. With the 3 dimensional IC circuit design concept a 3-D super computer can be designed with its data signal and instructions processing power millions time faster than the present computer we know of.
Keywords :
computer architecture; integrated circuit design; mainframes; parallel machines; power aware computing; three-dimensional integrated circuits; 3D super computer architecture; 3D-IC design; data signal; global warming regulation; instruction processing power; less power consumption; Circuit synthesis; Computer architecture; Computers; Electronic mail; Global warming; Integrated circuits; Power demand;
Conference_Titel :
Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4577-1647-8
