DocumentCode
556845
Title
Simulation analysis of relation between tool variability and cycle time
Author
Okumura, Hiroyuki
Author_Institution
Renesas Electronics Corporation
fYear
2011
fDate
5-6 Sept. 2011
Firstpage
1
Lastpage
10
Abstract
A collection of slides from the author´s conference presentation about the simulation analysis of relation between tool variability and cycle time is presented.
Keywords
semiconductor device manufacture; cycle time; tool variability; Availability; Collaboration; Electric breakdown; Investments; Joints; Load modeling; Manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
Conference_Location
Hsinchu
ISSN
1523-553X
Print_ISBN
978-1-4577-1647-8
Type
conf
Filename
6086072
Link To Document