• DocumentCode
    557356
  • Title

    Combination of sensitivity encoding and Partial Fourier in fast thin-slab 3D MR imaging

  • Author

    He, Shan ; Xie, Guo-Xi ; Feng, Xiang ; Chung, Yiu-Cho ; Liu, Jie-Ping ; Liu, Xin

  • Author_Institution
    Paul C. Lauterber Res. Center for Biomed. Image, Shenzhen Inst. of Adv. Technol., Shenzhen, China
  • Volume
    1
  • fYear
    2011
  • fDate
    15-17 Oct. 2011
  • Firstpage
    197
  • Lastpage
    200
  • Abstract
    Sensitivity Encoding (SENSE) has been widely used in fast imaging which removes the aliasing using coil sensitivities. However there are two problems applied in the second phase encoding (slice) direction in thin slab 3D imaging. First, the received B1 field knowledge may not be able to provide adequate sensitivity information due to the region of the coil cover is small. Second, the noise amplification of the reconstruction of SENSE will further expand the influence of RF leakage which degrades the quality of the image. In this work, we propose a 3D fast imaging method which combines Partial Fourier acquisition along second phase encoding (slice) direction with SENSE along first phase encoding (phase) direction. The method can efficiently reduces acquisition time with high image quality. The result of experiments using 3D GRE sequence in phantom at 3T Siemens system showed the performance of this approach.
  • Keywords
    Fourier analysis; biomedical MRI; image coding; image sequences; medical image processing; phantoms; 3D GRE sequence; 3T Siemens system; SENSE; coil sensitivities; fast thin-slab 3D MR imaging; first phase encoding; image quality; noise amplification; partial Fourier acquisition; phantom; reconstruction; second phase encoding; slab 3D imaging; Coils; Encoding; Image quality; Image reconstruction; Imaging; Sensitivity; Three dimensional displays; Partial Fourier; SENSE; fast 3D MRI;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Biomedical Engineering and Informatics (BMEI), 2011 4th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-9351-7
  • Type

    conf

  • DOI
    10.1109/BMEI.2011.6098257
  • Filename
    6098257