DocumentCode
557464
Title
Computational modeling analysis for cell growth using Electric Cell-substrate Impedance Sensing (ECIS) based time series data
Author
Yang, Jen-Ming ; Chen, Szi-Wen ; Yang, Jhe-Hao ; Wang, Jong-Shyan
Author_Institution
Dept. of Chem. & Mater. Eng., Chang Gung Univ., Taoyuan, Taiwan
Volume
2
fYear
2011
fDate
15-17 Oct. 2011
Firstpage
938
Lastpage
941
Abstract
In this paper, a computational modeling analysis on cell growth is presented. This study aims at deriving a mathematical model for cell growth in order to understand, analyze and predict the complex mechanisms of cell biological systems. The proposed model was derived and validated using the practically measured cell growth curves produced by an existing novel on-line monitoring technique, referred to as Electric Cell-substrate Impedance Sensing (ECIS). The model in the form of a time response function may reflect the resistance change as a result of cell proliferation. Model parameters were then estimated by fitting the measured time series impedance data to the model itself. Preliminary analysis results indicated that the computational model proposed in this study possessed good potentials to modeling analysis on cell growth and thus could provide a hopeful start for subsequent quantitative investigations into cell dynamics.
Keywords
cellular biophysics; electric impedance measurement; electric sensing devices; mathematical analysis; time series; cell dynamics; cell growth; cell proliferation; computational modeling analysis; electric cell-substrate impedance sensing; mathematical model; on-line monitoring technique; time response function; time series impedance data; Computational modeling; Electrical resistance measurement; Electrodes; Immune system; Impedance; Resistance; Sensors; Electric Cell-substrate Impedance Sensing (ECIS); cell proliferation; modeling analysis; on-line cell monitoring;
fLanguage
English
Publisher
ieee
Conference_Titel
Biomedical Engineering and Informatics (BMEI), 2011 4th International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-9351-7
Type
conf
DOI
10.1109/BMEI.2011.6098447
Filename
6098447
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