60GHz antenna integrated transmitter module using 3-D SiP technology and organic substrates

Author

Suematsu, Noriharu ; Yoshida, Satoshi ; Tanifuji, Shoichi ; Kameda, Suguru ; Takagi, Tadashi ; Tsubouchi, Kazuo

Author_Institution

Tohoku Univ., Sendai, Japan

fYear

2011

fDate

10-13 Oct. 2011

Firstpage

551

Lastpage

554

Abstract

A low cost, ultra small antenna integrated wireless transceiver is one of the key technologies for short range millimeter-wave wireless communication. A RF module with integrated antenna will be presented. It consists of low cost organic multi-layer substrates and MMICs. The substrates are vertically stacked by employing Cu ball bonding 3-D system in package (SiP) technology and MMIC´s are mounted on the organic substrates by using stud bump bonding (SBB) technique. The antenna performance with RF module will be presented. The results show the feasibility of millimeter-wave low cost, ultra small antenna integrated module using organic substrates.

Keywords

MMIC; antennas; radio transceivers; substrates; system-in-package; 3D SiP technology; Cu ball bonding 3D system in package; MMIC; RF module; antenna integrated transmitter module; frequency 60 GHz; low cost organic multilayer substrates; low cost ultra small antenna integrated wireless transceiver; organic substrates; short range millimeter-wave wireless communication; stud bump bonding; Antenna measurements; Dipole antennas; MMICs; Radio frequency; Substrates; Transmitting antennas; Antenna Integration; MMIC; Millimeter-wave; Module; RFIC; SiP; Stud bump;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference (EuMC), 2011 41st European

Conference_Location

Manchester

Print_ISBN

978-1-61284-235-6

Type

conf

Filename

6101998