DocumentCode :
558355
Title :
Activities and progress of advanced microwave and system-in-package integration at National Taiwan University
Author :
Wang, Huei ; Wu, Ruey-Beei ; Hsu, Powen ; Wu, Tzong-Lin ; Huang, Tain-Wei ; Tzuang, C-K Clive
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear :
2011
fDate :
10-13 Oct. 2011
Firstpage :
555
Lastpage :
558
Abstract :
The recent research efforts on advanced microwave and millimeter-wave (MMW) technologies and system-in-packaging (SiP) in National Taiwan University (NTU) are presented in this paper. The scope of our researches includes passive elements, monolithic microwave integrated circuits (MMICs), MMW SiP integration techniques, electromagnetic compatibility (EMC), and system integrations. Significant results have been achieved.
Keywords :
MMIC; electromagnetic compatibility; system-in-package; MMIC; MMW SiP integration; National Taiwan University; electromagnetic compatibility; microwave technology; millimeter-wave technology; monolithic microwave integrated circuits; passive elements; system-in-package integration; Band pass filters; CMOS integrated circuits; Gain; Integrated circuit modeling; Microwave technology; Resonator filters; EMC; MMICs; SiP; passive components;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference (EuMC), 2011 41st European
Conference_Location :
Manchester
Print_ISBN :
978-1-61284-235-6
Type :
conf
Filename :
6101999
Link To Document :
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