• DocumentCode
    559573
  • Title

    Meter-scale surface capacitive type of touch sensors fabricated by weaving conductive-polymer-coated fibers

  • Author

    Takamatsu, Seiichi ; Kobayashi, Takeshi ; Shibayama, Nobuhisa ; Miyake, Koji ; Itoh, Toshihiro

  • Author_Institution
    BEANS Lab., Macro BEANS Center, Tsukuba, Japan
  • fYear
    2011
  • fDate
    11-13 May 2011
  • Firstpage
    142
  • Lastpage
    147
  • Abstract
    We report on surface capacitive type of touch sensor fabric for large-area electronic devices. The fibers on which conductive and dielectric polymers were coated, were woven as wefts and warps in the pitch of 5 cm. The woven fabric sensed surface capacitances between the conductive polymer-coated fibers and human fingers and then the touched point was detected. To process long fibers (>;100 m), we developed the die-coating technology applied to plastic fibers for coating conductive polymer of PEDOT:PSS and dielectric one of UV-curable adhesive. The resultant fibers were woven with automatic looming machines, forming meter-scale devices (1.2 m × 3 m). The fabricated sensor fabric was examined on the detection of human touch. Then, the sensor observed surface capacitance of about 0.5 pF by touching sensors with a human finger. Therefore, our sensor will lead to meter-scale touch sensors and input devices for various electronic devices.
  • Keywords
    coating techniques; conducting polymers; dielectric materials; fabrics; organic semiconductors; tactile sensors; weaving; PEDOT:PSS; UV-curable adhesive; automatic looming machines; die coating technology; dielectric one; dielectric polymers; human fingers; large-area electronic devices; meter-scale surface capacitive type; plastic fibers; resultant fibers; touch sensor fabric; weaving conductive-polymer-coated fibers; Capacitance; Fabrics; Humans; Optical fiber sensors; Tactile sensors; Weaving; Large area electronics; PEDOT:PSS; capacitive sensor; die-coating; weaving;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2011 Symposium on
  • Conference_Location
    Aix-en-Provence
  • Print_ISBN
    978-1-61284-905-8
  • Type

    conf

  • Filename
    6107981