DocumentCode :
559613
Title :
Implementing MEMS resonators in 90 nm CMOS
Author :
Ramstad, J.E. ; Michaelsen, J.A. ; Soeraasen, O. ; Wisland, D.
Author_Institution :
Dept. of Inf., Univ. of Oslo, Oslo, Norway
fYear :
2011
fDate :
11-13 May 2011
Firstpage :
116
Lastpage :
121
Abstract :
In the ubiquitous information age of today there is an increased interest in combining actuating and sensing technology with the advanced signal processing of the well established CMOS technology. With that in mind, this work investigates the possibility of making MEMS resonators in fine-pitch CMOS in contrast to making MEMS in more coarse-grain CMOS processes. This is done by using the metal layers in the CMOS process both as structural layers and as a mask, using only a few post-CMOS etch steps. A modern and mature 90 nm CMOS process from ST Microelectronics is used and test structures are analyzed. A set of design rules have been derived and a general design guideline is described. As a practical example, implemented MEMS frequency tunable resonators are shown that are intended to be used as VCOs in an FDSM system to show the feasibility of the work.
Keywords :
CMOS integrated circuits; masks; micromechanical resonators; signal processing; voltage-controlled oscillators; CMOS technology; FDSM system; MEMS resonators; STMicroelectronics; VCO; actuating technology; advanced signal processing; fine-pitch CMOS; frequency tunable resonators; mask; metal layers; post-CMOS etch steps; sensing technology; size 90 nm; structural layers; ubiquitous information; CMOS integrated circuits; CMOS process; Dielectrics; Metals; Micromechanical devices; Resonant frequency; Self-assembly;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2011 Symposium on
Conference_Location :
Aix-en-Provence
Print_ISBN :
978-1-61284-905-8
Type :
conf
Filename :
6108025
Link To Document :
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