• DocumentCode
    559749
  • Title

    Reliable full band tunable laser module realized by adhesive bonding technology

  • Author

    Sugaya, Toshio ; Ariga, Maiko ; Kimura, Toshio ; Akizuki, Kazunori ; Nakajima, Yasuo ; Arashitani, Yoshihiro

  • Author_Institution
    Opt. Device Dept., Furukawa Electr. Co., Ltd., Chiba, Japan
  • fYear
    2011
  • fDate
    Oct. 30 2011-Nov. 2 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We developed the highly reliable FBT (Full Band Tunable) DFB laser module by applying adhesive bonding technology to internal micro optical components, which enabled the flexible module design to realize higher optical output power with lower power consumption. The reliability necessary for telecommunication WDM(Wavelength Division Multiplexing) application has been tested and confirmed through detailed analysis on outgas from the cured adhesive as well as the reliability test on the assembled modules.
  • Keywords
    adhesive bonding; distributed feedback lasers; laser reliability; laser tuning; micro-optics; optical communication equipment; semiconductor optical amplifiers; wavelength division multiplexing; DFB laser; adhesive bonding technology; flexible module design; internal microoptical components; optical output power; power consumption; reliability; reliable full band tunable laser module; telecommunication WDM; wavelength division multiplexing; Optical design; Reliability engineering; Semiconductor lasers; Welding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microopics Conference (MOC), 2011 17th
  • Conference_Location
    Sendai
  • Print_ISBN
    978-1-4577-1344-6
  • Type

    conf

  • Filename
    6110303