DocumentCode :
560348
Title :
R&D Investment of Chinese Enterprises Based on Responding to TBT
Author :
Li, Feng ; Wu, Ling ; Zhao, Lu
Author_Institution :
Bus. Sch., Hohai Univ., Nanjing, China
Volume :
1
fYear :
2011
fDate :
26-27 Nov. 2011
Firstpage :
295
Lastpage :
298
Abstract :
In recent years, China´s export has been encountering increasingly severe technical barriers to trade (TBT) from the importing countries, which has a significant negative impact on its exports, employment and so on. The top five industries affected by TBT the most include mechanical and electrical equipment, toys and furniture, timber and paper and non-metallic, agriculture and food products, and chemical and ore metals. The main reason why Chinese export enterprises suffer TBT is that they lack R&D investment, which is reflected by the following: the R&D investment intensity of Chinese enterprises is relatively low, corporate R&D personnel account for a very low proportion of the total labor force, the scale of the enterprises with R&D activities is too small, and the number of invention patents of Chinese enterprises is too small. The strategies to promote Chinese enterprises to increase R&D investment are to create a favorable external environment for R&D investment, strengthen business awareness of R&D investment, and broaden the funding source of enterprise R&D.
Keywords :
international trade; investment; research and development management; China export; Chinese enterprise; R&D investment; TBT; agriculture product; corporate R&D personnel; electrical equipment; enterprise R&D; food product; invention patent; labor force; mechanical equipment; nonmetallic product; ore metal; technical barrier to trade; timber and paper; toys and furniture; Companies; Educational institutions; Investments; Personnel; Standards; Technological innovation; R&D investment; Technical Barriers to Trade;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Information Management, Innovation Management and Industrial Engineering (ICIII), 2011 International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-61284-450-3
Type :
conf
DOI :
10.1109/ICIII.2011.75
Filename :
6115485
Link To Document :
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