• DocumentCode
    560470
  • Title

    Simulation of multiconductor transmission lines using block-latency insertion method and model order reduction technique

  • Author

    Sekine, Tadatoshi ; Asai, Hideki

  • Author_Institution
    Dept. of Inf. Sci. & Tech., Shizuoka Univ., Hamamatsu, Japan
  • fYear
    2011
  • fDate
    6-9 Nov. 2011
  • Firstpage
    203
  • Lastpage
    206
  • Abstract
    This paper describes a fast circuit simulation technique based on the block-latency insertion method (block-LIM) and a model order reduction (MOR) technique. The block-LIM is one of the efficient transient analysis methods adopting an explicit leapfrog finite difference method. In the block-LIM, due to duality of voltage and current variables, they are successfully separated from each other by using a staggered time step placement. Thus, each of them can be updated individually within a local block through a time stepping procedure. In this work, we build a reduced order model of the partitioned local block to improve the efficiency of the block-LIM. Compared to other circuit partitioning techniques coupled with the MOR, the order-reduced block-LIM can easily decrease whole computational costs of the transient simulation. Numerical results show that our approach is adequate for the fast simulation of tightly coupled multiconductor transmission lines with CMOS inverters.
  • Keywords
    CMOS integrated circuits; circuit simulation; coupled transmission lines; finite difference methods; invertors; multiconductor transmission lines; transient analysis; CMOS inverters; block-latency insertion; circuit partitioning; explicit leapfrog finite difference method; fast circuit simulation; model order reduction; multiconductor transmission lines; partitioned local block; time stepping; transient analysis; Electromagnetic compatibility; Integrated circuit interconnections; Integrated circuit modeling; Mathematical model; RLC circuits; Topology; Transient analysis; CMOS inverter; block latency insertion method; fast circuit simulation; model order reduction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2011 8th Workshop on
  • Conference_Location
    Dubrovnik
  • Print_ISBN
    978-1-4577-0862-6
  • Type

    conf

  • Filename
    6130064