DocumentCode
560470
Title
Simulation of multiconductor transmission lines using block-latency insertion method and model order reduction technique
Author
Sekine, Tadatoshi ; Asai, Hideki
Author_Institution
Dept. of Inf. Sci. & Tech., Shizuoka Univ., Hamamatsu, Japan
fYear
2011
fDate
6-9 Nov. 2011
Firstpage
203
Lastpage
206
Abstract
This paper describes a fast circuit simulation technique based on the block-latency insertion method (block-LIM) and a model order reduction (MOR) technique. The block-LIM is one of the efficient transient analysis methods adopting an explicit leapfrog finite difference method. In the block-LIM, due to duality of voltage and current variables, they are successfully separated from each other by using a staggered time step placement. Thus, each of them can be updated individually within a local block through a time stepping procedure. In this work, we build a reduced order model of the partitioned local block to improve the efficiency of the block-LIM. Compared to other circuit partitioning techniques coupled with the MOR, the order-reduced block-LIM can easily decrease whole computational costs of the transient simulation. Numerical results show that our approach is adequate for the fast simulation of tightly coupled multiconductor transmission lines with CMOS inverters.
Keywords
CMOS integrated circuits; circuit simulation; coupled transmission lines; finite difference methods; invertors; multiconductor transmission lines; transient analysis; CMOS inverters; block-latency insertion; circuit partitioning; explicit leapfrog finite difference method; fast circuit simulation; model order reduction; multiconductor transmission lines; partitioned local block; time stepping; transient analysis; Electromagnetic compatibility; Integrated circuit interconnections; Integrated circuit modeling; Mathematical model; RLC circuits; Topology; Transient analysis; CMOS inverter; block latency insertion method; fast circuit simulation; model order reduction;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2011 8th Workshop on
Conference_Location
Dubrovnik
Print_ISBN
978-1-4577-0862-6
Type
conf
Filename
6130064
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