DocumentCode
56052
Title
Equivalent Electrical Model and Software Tool for SPICE-Compatible Thermal Simulations of High-Power Resistors
Author
Nuno, Fernando ; Parrondo, Jorge ; Pernia, Alberto M. ; Barrio, R. ; Villegas, Pedro J. ; Prieto, Miguel J. ; Barquilla, Pastora
Author_Institution
Electr. Eng. Dept., Univ. de Oviedo, Gijon, Spain
Volume
4
Issue
5
fYear
2014
fDate
May-14
Firstpage
859
Lastpage
869
Abstract
Optimized design of high-power braking resistors for traction applications is a complex task. The value of the power dissipated can be very high (up to the order of megawatts) and normally pulsating. In addition, these resistors should stay in predefined, usually small areas on the train, which makes them have to meet some tough specifications: minimum weight, high resistance to vibration, and high reliability and durability. Since it is necessary to anticipate and establish the distribution and evolution of the temperatures reached in different internal areas, it would be necessary to develop a complete numerical simulation using a software tool based on computational fluid dynamics (CFD) for each design, which implies a very high-computational cost. In this paper, a new equivalent electrical circuit is proposed to model the thermal behavior of this kind of resistors. The electrical equivalent circuit parameters are obtained by a newly developed software tool that collects results and trends obtained from a large number of previous CFD simulations. After that, SPICE can be employed to obtain thermal simulations and predict temperature evolutions.
Keywords
SPICE; braking; computational fluid dynamics; equivalent circuits; mechanical engineering computing; numerical analysis; power engineering computing; railway electrification; resistors; traction power supplies; CFD simulations; SPICE-compatible thermal simulations; computational fluid dynamics; equivalent electrical circuit parameters; equivalent electrical model; high durability; high reliability; high vibration resistance; high-power braking resistor design; minimum weight; numerical simulation; power dissipation value; software tool; thermal behavior; traction applications; Atmospheric modeling; Computational fluid dynamics; Cooling; Integrated circuit modeling; Resistors; Thermal resistance; Equivalent electric model; numerical simulations; power braking resistors; thermal behavior; thermal behavior.;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2013.2296622
Filename
6709739
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