DocumentCode :
560783
Title :
Maximum interface shear stress in the cermet cladding part under steady thermal load
Author :
Yang Junru ; Li Zhaoqian ; Chen Gongling ; Huang Chuanzhen
Author_Institution :
Coll. of Mech. & Electr. Eng., SDUST, Qingdao, China
fYear :
2010
fDate :
23-25 Nov. 2010
Firstpage :
56
Lastpage :
61
Abstract :
Taking the cermet cladding plate part as the study object, according to the thermal elastic mechanics, with Rayleigh-Ritz method, the thermal stress field in the part under steady thermal load is solved. And the theoretical model of the maximum interface shear stress in the part is built. Based on the theoretical model, an example research on the maximum interface shear stress with the finite element method (FEM) is made. The results show that, under the steady thermal load, the maximum interface shear stress in the cladding part increases with the growth of the temperature, the clad thickness ratio and the thermal expansion coefficient difference of the materials of the cladding layer and the substrate. Under the steady thermal load, in order to avoid the interface failure of the cladding part, the design principle that the maximum interface shear stress can not exceed the interface shear strength of the corresponding cladding part material is proposed.
Keywords :
Rayleigh-Ritz methods; cermets; cladding techniques; design engineering; failure analysis; finite element analysis; plates (structures); shear strength; thermal expansion; thermal stresses; FEM; Rayleigh-Ritz method; cermet cladding plate; clad thickness ratio; cladding part material; design principle; finite element method; interface failure; maximum interface shear stress; shear strength; steady thermal load; thermal elastic mechanics; thermal expansion coefficient; thermal stress field; Cermet cladding part; Finite element analysis; Maximum interface shear stress; Steady thermal load;
fLanguage :
English
Publisher :
iet
Conference_Titel :
Advanced Technology of Design and Manufacture (ATDM 2010), International Conference on
Conference_Location :
Beijing
Type :
conf
DOI :
10.1049/cp.2010.1260
Filename :
6138980
Link To Document :
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