Highlights of 2011 iNEMI Technology Roadmap

Author

Bader, Bill ; Richardson, Chuck ; Pfahl, Robert C., Jr. ; O´Malley, Grace

Author_Institution

Int. Electron. Manuf. Initiative (iNEMI), Herndon, VA, USA

fYear

2011

fDate

12-15 Sept. 2011

Firstpage

1

Lastpage

9

Abstract

iNEMI released its 2011 Technology Roadmap to industry on March 29, 2011. The Roadmap covers six product segments and 21 technology areas pertinent to electronics manufacturing. Every two years iNEMI maps future manufacturing technology needs of the global electronics industry for the next ten years. It discusses the major business and technology issues, paradigm shifts, emerging technologies and markets, technology gaps, and identified needs in each of six product segments: aerospace/defense, automotive, consumer/portable, medical, Netcom, and office/large business systems. This paper highlights two product sector chapters (Automotive, Medical) and three technology chapters (MEMS, Packaging, and Environmentally Conscious Electronics).

Keywords

electronics industry; electronics packaging; micromechanical devices; 2011 iNEMI technology roadmap; AD 2011 03 29; MEMS; electronics manufacturing; electronics packaging; environmentally conscious electronics; global electronics industry; manufacturing technology needs; paradigm shifts; technology gaps; Biomedical optical imaging; Lead; Micromechanical devices; Nanoelectromechanical systems; Optical device fabrication; Optical sensors; Reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics and Packaging Conference (EMPC), 2011 18th European

Conference_Location

Brighton

Print_ISBN

978-1-4673-0694-2

Type

conf

Filename

6142352