DocumentCode :
561034
Title :
Effects of different combinations of environmental tests on the reliability of UHF RFID tags
Author :
Saarinen, Kirsi ; Frisk, Laura ; Ukkonen, Leena
Author_Institution :
Dept. of Electron., Tampere Univ. of Technol., Tampere, Finland
fYear :
2011
fDate :
12-15 Sept. 2011
Firstpage :
1
Lastpage :
5
Abstract :
Accelerated environmental tests can be used to study the effects of environmental stresses on reliability. Typically environmental tests are used in parallel so that only one test is performed for test samples and new test samples are used in another test. However, different tests one after another for the same test samples may describe the operational environment better and give more reliable results in a short time. In addition, the different stresses may accelerate the effects of another stress, and such behaviour can be perceived if combinations of environmental tests are used. In this study, passive ultra high frequency (UHF) radio frequency identification (RFID) tags were tested with different combinations of environmental tests. Some of the tags were kept first in a bending test, in a constant humidity test or in a temperature cycling test, and then subjected to a humidity cycling test. In addition, as a reference some of the tags were tested only in the humidity cycling test. Changes in the performance parameters of the RFID tags were examined during testing. The tags which were held first in the constant humidity test failed significantly faster than the other test combinations. Consequently, on the basis of this study, it is important to study the effect of sequential environmental tests on the same test samples.
Keywords :
bending; environmental stress screening; radiofrequency identification; telecommunication network reliability; accelerated environmental test; bending testing; environmental stress effect; humidity cycling testing; passive UHF RFID tag reliability; passive ultrahigh frequency radiofrequency identification tag reliability; temperature cycling testing; test sample performance; Flip chip; Heating; Humidity measurement; Q measurement; Radiofrequency identification; Reliability; Environmental testing; radio frequency identification; reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics and Packaging Conference (EMPC), 2011 18th European
Conference_Location :
Brighton
Print_ISBN :
978-1-4673-0694-2
Type :
conf
Filename :
6142416
Link To Document :
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