• DocumentCode
    56202
  • Title

    Power Electronic Module: Enabling the 21st-century energy economy

  • Author

    Shenai, Krishna

  • Author_Institution
    Energy Syst. Div., Argonne Nat. Lab., Argonne, IL, USA
  • Volume
    1
  • Issue
    3
  • fYear
    2014
  • fDate
    Sept. 2014
  • Firstpage
    27
  • Lastpage
    32
  • Abstract
    To enable the rapidly emerging and imminent energy economy, high-voltage (HV) and high-current robust power electronic modules (PEMs) are needed at low cost. PEMs typically consist of a number of semiconductor power switches and driver chips; intelligent power modules often contain sensing and protection circuitry. In the entire supply chain of power electronics systems-from materials to end-user applications, including the original equipment manufacturers (OEMs)-the PEM is the key building block, as it forms the heart of a power electronic system. The performance, cost, and durability of the entire power electronic system critically hinge on those of the PEM. In addition, major business opportunities in power electronics are often enabled by the advances in power semiconductor devices. One such opportunity currently available to the power electronics community has been created by the advances in wide-bandgap (WBG) power switching devices, which were first introduced by Shenai et al. in the 1980s [1].
  • Keywords
    driver circuits; power electronics; 21st-century energy economy; OEM; PEM; driver chips; end-user applications; high-current robust power electronic modules; intelligent power modules; original equipment manufacturers; power semiconductor devices; protection circuitry; semiconductor power switches; sensing circuitry; wide-bandgap power switching devices; Field effect transistors; High-voltage techniques; Insulated gate bipolar transistors; Multichip modules; Power system economics; Semiconductor devices; Silicon carbide; Supply chain management; Switches;
  • fLanguage
    English
  • Journal_Title
    Power Electronics Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    2329-9207
  • Type

    jour

  • DOI
    10.1109/MPEL.2014.2330459
  • Filename
    6891468