Metal migration at conductor / XLPE interface subjected to partial discharges at different electrical stresses

Metal migration effects occurring at the conductor/cross-linked polyethylene (XLPE) interface are presented in the paper. The phenomenon was studied under various electrical stresses: direct current, pulse-width modulated and sinusoidal. The comparison of aging effects on specimens subjected to the stimuli was presented. The electrical stress results in partial discharges, both around the electrode in the form of surface discharges and directly at the micro air gap interface between conductor and polymeric material. In order to isolate the impact of interface discharges, the surface effects were suppressed, eliminated and compared with results containing both forms of discharges. The electrical and thermal migration mechanism was investigated in the paper and assessment was performed by means of time to breakdown and both micro morphological and elemental analysis. Migration of the conductor atoms, where metallic particles are transferred to the insulating medium, was observed. Primarily, attention was afforded to the migration of copper and aluminum electrode atoms in two zones; one zone being the direct contact area at the interface and the second zone incorporating the area surrounding the electrode which is enhanced by surface discharges. A novel aspect relates to the investigation of the metal migration depth profile and the concentration intensity at different voltage stresses. The transport phenomena were analyzed with respect to both electrical and thermal mechanisms.