DocumentCode :
563473
Title :
Sub-threshold and active-region characterization of ion-implanted buried-channel MOS transistors
Author :
Schemmert, W. ; Gabler, L. ; Hoefflinger, B.
Author_Institution :
Univ. Dortmund, Dortmund, Germany
fYear :
1974
fDate :
9-11 Dec. 1974
Firstpage :
546
Lastpage :
549
Abstract :
The drain current versus gate voltage characteristics of ion-implanted buried-channel MOS transistors were measured and compared with a theory based on the in-depth impurity, mobile carrier, potential and mobility distribution. In more heavily implanted transistors, a characteristic sub-threshold current almost independent of gate voltage is obtained both experimentally and theoretically. For these cases, a new definition of threshold voltage is suggested. According to their potential distribution at threshold, implanted transistors are classified into three groups. The depths and widths of buried channels fall into the transition region from surface to bulk carrier mobility. Models for the mobility distribution including surface and impurity scattering as well as field dependence were used to calculate the active-region conductance.
Keywords :
MOSFET; carrier mobility; impurity scattering; ion implantation; active-region characterization; active-region conductance; bulk carrier mobility; characteristic subthreshold current; drain current; gate voltage characteristics; impurity scattering; in-depth impurity; ion-implanted buried-channel MOS transistors; mobility distribution; subthreshold characterization; threshold voltage; Abstracts; Electric potential; Face; Impurities; Logic gates; Semiconductor device measurement; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 1974 International
Conference_Location :
Washington, DC
ISSN :
0163-1918
Type :
conf
DOI :
10.1109/IEDM.1974.6219681
Filename :
6219681
Link To Document :
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