• DocumentCode
    564128
  • Title

    A high speed two-stage dual-path operational amplifier in 40nm digital CMOS

  • Author

    Chen, Hong ; Milovanovic, Vladimir ; Zimmermann, Horst

  • Author_Institution
    Inst. of Electrodynamics, Microwave & Circuit Eng., Vienna Univ. of Technol., Vienna, Austria
  • fYear
    2012
  • fDate
    24-26 May 2012
  • Firstpage
    198
  • Lastpage
    202
  • Abstract
    This paper presents a design of a high speed operational amplifier using 40nm digital CMOS technology. The proposed two-stage dual-path fully differential topology is based on the Improved Recycling Folded Cascode (IRFC) topology. The IRFC first stage provides a moderate DC gain, and the high efficient dual-path push-pull output stage provides ultra-high unity-gain frequency bandwidth (UGBW) with relatively low power consumption. It could find wide application in high bandwidth high resolution analog-to-digital converters (ADCs). Under 1.1V supply voltage, the simulation results show that the proposed operational amplifier topology could achieve 56.3dB DC gain, 3GHz UGBW, 24.8μV RMS noise integrated from DC to 50MHz and 2.9ns settling time with 1V peak-to-peak differential input signal.
  • Keywords
    CMOS digital integrated circuits; high-speed integrated circuits; integrated circuit design; low-power electronics; operational amplifiers; analog-to-digital converters; differential input signal; digital CMOS technology; frequency 0 MHz to 50 MHz; frequency 3 GHz; gain 56.3 dB; high efficient dual-path push-pull output stage; high speed two-stage dual-path operational amplifier; improved recycling folded cascode topology; low power consumption; moderate DC gain; size 40 nm; time 2.9 ns; two-stage dual-path fully differential topology; ultra-high unity-gain frequency bandwidth; voltage 1.1 V; voltage 24.8 muV; Bandwidth; CMOS integrated circuits; CMOS technology; Noise; Operational amplifiers; Topology; Transconductance; dual-path; high speed; operational amplifier; recycling folded cascode;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mixed Design of Integrated Circuits and Systems (MIXDES), 2012 Proceedings of the 19th International Conference
  • Conference_Location
    Warsaw
  • Print_ISBN
    978-1-4577-2092-5
  • Type

    conf

  • Filename
    6226200