Preface

This Symposium is a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule, in 2004 and 2005 in Montreux, Switzerland and in 2006 and in 2007 in Stresa, Italy, in 2008 in Nice, France, in 2009 in Rome, Italy, in 2010 in Séville, Spain and Aix-en-Provence, France in 2011. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. We hope you enjoy the technical presentations of two conferences - CAD, Design and Test / Microfabrication, Integration and Packaging -, of three joint invited talks, and of four special sessions, on Point of Care Diagnostic Devices, on Bio-MEMS/NEMS, on Wireless Networked Green Sensor Systems and on Low Temperature Cofired Ceramic for MEMS.