Large-scale and flexible MEMS-IC integration by using carrier wafer

This paper presents our recent progress on a flexible and size-free MEMS-IC integration process for MEMS ubiquitous applications in wireless sensor network (WSN). In our proposal, MEMS and IC known-good-dies (KGD) are temporarily bonded onto carrier wafer with rapid and high-accurate self-alignment by using hydrophobic surface assembled monolayer (SAM) fine pattern and capillary force of H₂O; and then those KGDs are transferred from carrier wafer to target wafer by using low damage metal to metal permanent bonding with plasma surface activation prior to bonding to reduce bonding temperature and bonding load force. By applying above 2 steps for MEMS-IC integration, size of both MEMS/IC processed wafers and dies is flexible, and various MEMS/IC KGDs can be integrated with high efficiency and relatively low cost.