DocumentCode
565129
Title
Steady-state dynamic temperature analysis and reliability optimization for embedded multiprocessor systems
Author
Ukhov, Ivan ; Bao, Min ; Eles, Petru ; Peng, Zebo
Author_Institution
Linkoping Univ., Linkoping, Sweden
fYear
2012
fDate
3-7 June 2012
Firstpage
197
Lastpage
204
Abstract
In this paper we propose an analytical technique for the steady-state dynamic temperature analysis (SSDTA) of multiprocessor systems with periodic applications. The approach is accurate and, moreover, fast, such that it can be included inside an optimization loop for embedded system design. Using the proposed solution, a temperature-aware reliability optimization, based on the thermal cycling failure mechanism, is presented. The experimental results confirm the quality and speed of our SSDTA technique, compared to the state of the art. They also show that the lifetime of an embedded system can significantly be improved, without sacrificing its energy efficiency, by taking into consideration, during the design stage, the steady-state dynamic temperature profile of the system.
Keywords
embedded systems; integrated circuit reliability; microprocessor chips; multiprocessing systems; performance evaluation; power aware computing; SSDTA technique quality; SSDTA technique speed; analytical technique; embedded multiprocessor system design; energy efficiency; optimization loop; periodic applications; steady-state dynamic temperature analysis; temperature-aware reliability optimization; thermal cycling failure mechanism; Approximation methods; Equations; Mathematical model; Optimization; Reliability; Steady-state; Symmetric matrices; Leakage Power; Multiprocessor System; Periodic Power Profile; Temperature Analysis; Thermal Cycling Fatigue;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference (DAC), 2012 49th ACM/EDAC/IEEE
Conference_Location
San Francisco, CA
ISSN
0738-100X
Print_ISBN
978-1-4503-1199-1
Type
conf
Filename
6241511
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