Title :
Test-data volume optimization for diagnosis
Author :
Hongfei Wang ; Poku, O. ; Xiaochun Yu ; Sizhe Liu ; Komara, I. ; Blanton, R.D.
Author_Institution :
ECE Dept., Carnegie Mellon Univ., Pittsburgh, PA, USA
Abstract :
Test data collection for a failing integrated circuit (IC) can be very expensive and time consuming. Many companies now collect a fix amount of test data regardless of the failure characteristics. As a result, limited data collection could lead to inaccurate diagnosis, while an excessive amount increases the cost not only in terms of unnecessary test data collection but also increased cost for test execution and data-storage. In this work, the objective is to develop a method for predicting the precise amount of test data necessary to produce an accurate diagnosis. By analyzing the failing outputs of an IC during its actual test, the developed method dynamically determines which failing test pattern to terminate testing, producing an amount of test data that is sufficient for an accurate diagnosis analysis. The method leverages several statistical learning techniques, and is evaluated using actual data from a population of failing chips and five standard benchmarks. Experiments demonstrate that test-data collection can be reduced by >; 30% (as compared to collecting the full-failure response) while at the same time ensuring >;90% diagnosis accuracy. Prematurely terminating test-data collection at fixed levels (e.g., 100 failing bits) is also shown to negatively impact diagnosis accuracy.
Keywords :
failure analysis; fault diagnosis; integrated circuit testing; optimisation; statistical analysis; data storage; diagnosis analysis; failing chips; failing integrated circuit; failure characteristics; statistical learning; test execution; test-data volume optimization; Accuracy; Integrated circuit modeling; Measurement; Predictive models; Statistical learning; Testing; Diagnosis; Statistical Learning; Test Cost; Test Data Collection;
Conference_Titel :
Design Automation Conference (DAC), 2012 49th ACM/EDAC/IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4503-1199-1