Title :
Low temperature Au-Au bonding with VUV/O3 treatment
Author :
Okada, Akiko ; Nimura, Masatsugu ; Unami, Naoko ; Shigetou, Akitsu ; Noma, Hirokazu ; Sakuma, Katsuyuki ; Mizuno, Jun ; Shoji, Shuichi
Author_Institution :
Waseda Univ., Tokyo, Japan
fDate :
Jan. 31 2012-Feb. 2 2012
Abstract :
This paper describes low temperature Au-Au bonding with vacuum ultraviolet (VUV) irradiation in the presence of oxygen gas. The VUV/O3 treatment can remove organic contaminants of Au surfaces without damages. The Au surfaces after the VUV/O3 treatment were analyzed by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The results show that carbon-based contaminants were dramatically decreased and that there were no serious damages in Au surfaces by the VUV/O3 treatment. The Au-Au bonding with VUV/O3 treatment was achieved at 200 °C. The average of shear strength of about 80 MPa per unit area was obtained. Therefore, it was proved that VUV/O3 treatment is effective in Au-Au bonding.
Keywords :
X-ray photoelectron spectra; atomic force microscopy; gold; integrated circuit bonding; shear strength; surface treatment; ultraviolet radiation effects; AFM; Au-Au; VUV-O3 treatment; X-ray photoelectron spectroscopy; XPS; atomic force microscopy; carbon-based contaminants; low temperature bonding; organic contaminants; oxygen gas; shear strength; temperature 200 degC; vacuum ultraviolet irradiation; Bonding; Gold; Optical surface waves; Rough surfaces; Surface contamination; Surface roughness; Surface treatment;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2011 IEEE International
Conference_Location :
Osaka
Print_ISBN :
978-1-4673-2189-1
DOI :
10.1109/3DIC.2012.6263015
