DocumentCode
57013
Title
Task Migrations for Distributed Thermal Management Considering Transient Effects
Author
Zao Liu ; Tan, Sheldon X-D ; Xin Huang ; Hai Wang
Author_Institution
Dept. of Electr. Eng., Univ. of California, Riverside, Riverside, CA, USA
Volume
23
Issue
2
fYear
2015
fDate
Feb. 2015
Firstpage
397
Lastpage
401
Abstract
In this brief, a new distributed thermal management scheme using task migrations based on a new temperature metric called effective initial temperature is proposed to reduce the on-chip temperature variance and the occurrence of hot spots for many-core microprocessors. The new temperature metric derived from frequency domain moment matching technique incorporates both initial temperature and other transient effects to make optimized task migration decisions, which leads to more effective reduction of hot spots in the experiments on a 100-core microprocessor than the existing distributed thermal management methods.
Keywords
frequency-domain analysis; microprocessor chips; optimisation; thermal management (packaging); distributed thermal management scheme; frequency domain moment matching technique; many-core microprocessors; on-chip temperature variance; task migration decisions; temperature metric; thermal management methods; transient effects; Heat sinks; Microprocessors; Multicore processing; System-on-chip; Temperature distribution; Thermal management; Transient analysis; Distributed control; dynamic thermal management (DTM); many-core; multicore; task migration; task migration.;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2014.2309331
Filename
6781028
Link To Document