• DocumentCode
    57374
  • Title

    Parallel Transient Simulation of Package/Board Power Distribution Networks Based on a 2-D Overlapping Partitioning Methodology

  • Author

    Roy, Sandip ; Dounavis, Anestis

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Colorado State Univ., Fort Collins, CO, USA
  • Volume
    3
  • Issue
    12
  • fYear
    2013
  • fDate
    Dec. 2013
  • Firstpage
    2101
  • Lastpage
    2112
  • Abstract
    Typical SPICE models for characterization of package/board power distribution networks (PDNs) are based on a 2-D discretization of the Helmholtz wave equation and hence require high computational costs. In this paper, a novel waveform relaxation (WR) algorithm for the parallelizable simulation of PDNs is presented. The key feature of this paper is the development of a 2-D partitioning methodology with overlapping, which addresses the slow convergence of conventional nonoverlapping-based WR algorithms for PDNs. In addition, a hybrid iterative technique is proposed that can provide additional exchange of information between the overlapping subcircuits to further improve the convergence of traditional Gauss-Jacobi-based relaxation iterations. The overall algorithm is highly parallelizable and exhibits good scaling with both the size of the circuit matrices involved and the number of CPUs available. Numerical examples are presented to illustrate the validity and efficiency of the proposed paper.
  • Keywords
    Helmholtz equations; distribution networks; power transmission lines; waveform analysis; 2-D discretization; 2-d overlapping partitioning methodology; Gauss-Jacobi-based relaxation iterations; Helmholtz wave equation; computational costs; package/board power distribution networks; parallel transient simulation; parallelizable simulation; typical SPICE models; waveform relaxation algorithm; Algorithm design and analysis; Convergence; Partitioning algorithms; Power distribution; Transient analysis; Transmission lines; Convergence analysis; delay; overlapping; power distribution networks; power integrity; simultaneous switching noise; transient simulation; transmission line; waveform relaxation;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2013.2273035
  • Filename
    6567956