• DocumentCode
    57480
  • Title

    Design Considerations for Cooling High Heat Flux IC Chips With Microchannels

  • Author

    Kandlikar, Satish G.

  • Author_Institution
    Mech. Eng., Rochester Inst. of Technol., Rochester, NY, USA
  • Volume
    31
  • Issue
    4
  • fYear
    2014
  • fDate
    Aug. 2014
  • Firstpage
    43
  • Lastpage
    50
  • Abstract
    Thermal emergency in integrated circuits has become an important issue with aggressive scaling trends. Several novel cooling techniques are investigated in both academia and industry. Sophisticated active cooling techniques are required to mitigate the thermal issues faced by the chips in the current and future technologies.
  • Keywords
    cooling; integrated circuit design; thermal engineering; cooling high heat flux IC chip; integrated circuit; microchannel; thermal emergency; Coolants; Design methodology; Heat transfer; Heating; Integrated circuits; Microchannels; Tutorials;
  • fLanguage
    English
  • Journal_Title
    Design & Test, IEEE
  • Publisher
    ieee
  • ISSN
    2168-2356
  • Type

    jour

  • DOI
    10.1109/MDAT.2014.2299535
  • Filename
    6710118
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=57480