Study on preparation and properties of polyimide /MWNTs triple hybrid films

Author

Ming-yan Zhang ; Hai-xia Chen ; Yu-liang Ma ; Qiong Wu ; Chang Liu

Author_Institution

Key Lab. of Eng. Dielectr. & Its Applic., Harbin Univ. of Sci. & Technol., Harbin, China

fYear

2012

fDate

24-28 July 2012

Firstpage

1

Lastpage

4

Abstract

In this paper, polyimide/multi-walled carbon nanotubes(PI/MWNTs) triple hybrid films were fabricated through thermal imine process of pure polyamic acid and polyamic acid hybrid solution. Polyamic acid (PAA) hybrid solution was synthesized via in situ polymerization with 4, 4-diamino diphenyl ether (ODA) and pyromellitic acid dianhydride (PDMA) as monomers in DMAc solvent with MWNTs modified by mixed acid treatment under ultrasonic. The dispersibility of MWNTs in solvent was characterized before and after functionalization; the morphology of the PI/MWNTs hybrid films were investigated by SEM; the tensile strength and elongation at break of triple hybrid films were tested. The results showed that the dispersibility of modified MWNTs in DMAc had been obviously improved and the mechanical properties of the triple hybrid films were also improved.

Keywords

carbon nanotubes; elongation; filled polymers; mixtures; nanocomposites; nanofabrication; organic-inorganic hybrid materials; polymer films; polymer solutions; polymerisation; scanning electron microscopy; tensile strength; tensile testing; ultrasonic effects; 4, 4-diamino diphenyl ether; C; SEM; dispersions; elongation; in situ polymerization; mechanical properties; mixed acid treatment; morphology; polyamic acid; polyamic acid hybrid solution; polyimide-multiwalled carbon nanotubes triple hybrid films; pyromellitic acid dianhydride; tensile strength; tensile testing; thermal imine process; ultrasonic effects; Casting; Films; Polymers; Thermal degradation; Thermal stability; MWNTs; polyimide; properties; triple hybrid films;

fLanguage

English

Publisher

ieee

Conference_Titel

Properties and Applications of Dielectric Materials (ICPADM), 2012 IEEE 10th International Conference on the

Conference_Location

Bangalore

ISSN

2160-9225

Print_ISBN

978-1-4673-2852-4

Type

conf

DOI

10.1109/ICPADM.2012.6319008

Filename

6319008