DocumentCode
576307
Title
Feasibility of fault analysis based on intentional electromagnetic interference
Author
Takahashi, Junko ; Hayashi, Yu-ichi ; Homma, Naofumi ; Fuji, Hitoshi ; Aoki, Takafumi
Author_Institution
NTT Secure Platform Labs., Nippon Telegraph & Telephone Corp., Musashino, Japan
fYear
2012
fDate
6-10 Aug. 2012
Firstpage
782
Lastpage
787
Abstract
This paper presents the feasibility of fault analysis using intentional electromagnetic interference (IEMI). Fault analysis (FA) is a kind of implementation attack that intentionally extracts a secret key embedded in a secure device such as a smart card. An attacker injects a computational fault during the cryptographic calculation and he can extract a secret key. Recently, Hayashi et al. showed that temporal faults could be remotely injected during the cryptographic calculation using IEMI. They showed a case study in which an Advanced Standard Encryption (AES) secret key could be extracted through fault analysis. However, the characteristics of faults that can be induced by IEMI were not described. And, a threat of various FAs was not clear. In this paper, we examine in detail how the IEMI fault injection affects the fault occurrence of intermediate states in a cryptographic module and investigate the distribution of the IEMI generated faults. Furthermore, we classify previous FAs with respect to an attack model such as the type of faults needed to achieve a successful attack, and discuss the feasibility of FAs using IEMI based on the experimental results.
Keywords
cryptography; data privacy; electromagnetic interference; embedded systems; fault diagnosis; AES secret key; FA; IEMI; advanced standard encryption secret key; cryptographic module calculation; fault extraction analysis; intentional electromagnetic interference; secret key embedded system; secure device; smart card; Circuit faults; Doped fiber amplifiers; Electromagnetic interference; Encryption; Laser beams;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on
Conference_Location
Pittsburgh, PA
ISSN
2158-110X
Print_ISBN
978-1-4673-2061-0
Type
conf
DOI
10.1109/ISEMC.2012.6351665
Filename
6351665
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