• DocumentCode
    577005
  • Title

    Miniaturized wireless sensor node for earthquake monitoring applications

  • Author

    Wang, Kevin I-Kai ; Salcic, Zoran ; Wilson, Mathew R. ; Brook, Karl M.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Auckland, Auckland, New Zealand
  • fYear
    2012
  • fDate
    20-22 June 2012
  • Firstpage
    323
  • Lastpage
    326
  • Abstract
    Miniaturized wireless sensor nodes have demonstrated promising use in many application fields. This paper presents a new wireless sensor node designed for earthquake simulation and structural health monitoring applications. The sensor node is based on an ultra-low power System-on-Chip (SoC) microcontroller with an integrated sub-1GHz radio core. The node is also equipped with a temperature sensor and a 3-axis accelerometer to monitor its ambient environment and geotechnical movements. The sensor is designed targeting minimum physical size and power consumption. The shake table earthquake-like simulation showed that the node can correctly measure typical seismic acceleration and work autonomously for up to 17 days with continuous acceleration measurement and 30 minutes of effective radio transmission every day.
  • Keywords
    condition monitoring; earthquakes; geotechnical engineering; seismology; structural engineering computing; system-on-chip; wireless sensor networks; 3-axis accelerometer; SoC microcontroller; acceleration measurement; ambient environment; earthquake monitoring; earthquake simulation; geotechnical movement; miniaturized wireless sensor node; radio transmission; seismic acceleration; shake table earthquake-like simulation; structural health monitoring; temperature sensor; ultralow power system-on-chip; Accelerometers; Earthquakes; Microcontrollers; Peer to peer computing; Power demand; Wireless communication; Wireless sensor networks; smart particles; structural health monitoring; wireless sensor network;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Embedded Systems (SIES), 2012 7th IEEE International Symposium on
  • Conference_Location
    Karlsruhe
  • Print_ISBN
    978-1-4673-2685-8
  • Electronic_ISBN
    978-1-4673-2683-4
  • Type

    conf

  • DOI
    10.1109/SIES.2012.6356607
  • Filename
    6356607