• DocumentCode
    5777
  • Title

    Petri Net-Based Polynomially Complex Approach to Optimal One-Wafer Cyclic Scheduling of Hybrid Multi-Cluster Tools in Semiconductor Manufacturing

  • Author

    FaJun Yang ; NaiQi Wu ; Yan Qiao ; Mengchu Zhou

  • Author_Institution
    Dept. of Ind. EngineeringSchool of Electro-Mech. Eng., Guangdong Univ. of Technol., Guangzhou, China
  • Volume
    44
  • Issue
    12
  • fYear
    2014
  • fDate
    Dec. 2014
  • Firstpage
    1598
  • Lastpage
    1610
  • Abstract
    Due to the different behavior of single-arm and dual-arm cluster tools, it is challenging to schedule a hybrid multi-cluster tool containing both of them. This paper aims to find an optimal one-wafer cyclic schedule for such a multi-cluster tool. It is assumed that the bottleneck individual cluster tool in it is process-bound, thereby making it process-dominant. To do so, this paper models a hybrid multi-cluster tool with Petri nets. With this model, it derives the conditions under which individual cluster tools can operate in a paced way. Based on these conditions, this paper shows that for any process-dominant hybrid multi-cluster tool there is always a one-wafer cyclic schedule. Then, it develops the algorithms to find the minimal cycle time and the optimal one-wafer cyclic schedule. It is computationally efficient and easy-to-implement in practice. Examples are given to show the application and effectiveness of the proposed method.
  • Keywords
    Petri nets; polynomials; scheduling; semiconductor industry; Petri nets; optimal one-wafer cyclic scheduling; polynomials; process-dominant hybrid multicluster tool; semiconductor manufacturing; Load modeling; Petri nets; Robot kinematics; Scheduling; Semiconductor device manufacture; Hybrid multi-cluster tools; Petri net (PN); scheduling; semiconductor manufacturing;
  • fLanguage
    English
  • Journal_Title
    Systems, Man, and Cybernetics: Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2168-2216
  • Type

    jour

  • DOI
    10.1109/TSMC.2014.2318679
  • Filename
    6815731