• DocumentCode
    58319
  • Title

    Reconfigurable mosaic annular arrays

  • Author

    Thomenius, Kai ; Wodnicki, Robert ; Cogan, S. ; Fisher, Roy ; Burdick, Bill ; Smith, Lee ; Khuri-Yakub, Pierre ; Der-Song Lin ; Xuefeng Zhuang ; Bonitz, Barry ; Davies, Trevor ; Thomas, Gael ; Woychik, Charles

  • Author_Institution
    Massachusetts Inst. of Technol., Cambridge, MA, USA
  • Volume
    61
  • Issue
    7
  • fYear
    2014
  • fDate
    Jul-14
  • Firstpage
    1086
  • Lastpage
    1100
  • Abstract
    Mosaic annular arrays (MAA) based on reconfigurable array (RA) transducer electronics assemblies are presented as a potential solution for future highly integrated ultrasonic transducer subsystems. Advantages of MAAs include excellent beam quality and depth of field resulting from superior elevational focus compared with 1-D electronically scanned arrays, as well as potentially reduced cost, size, and power consumption resulting from the use of a limited number of beamforming channels for processing a large number of subelements. Specific design tradeoffs for these highly integrated arrays are discussed in terms of array specifications for center frequency, element pitch, and electronic switch-on resistance. Large-area RAs essentially function as RC delay lines. Efficient architectures which take into account RC delay effects are presented. Architectures for integration of the transducer and electronics layers of large-area array implementations are reviewed.
  • Keywords
    ultrasonic transducer arrays; RC delay line; array specifications; beam quality; beamforming channel; center frequency; electronic switch-on resistance; element pitch; highly integrated array; highly integrated ultrasonic transducer; reconfigurable array transducer electronics; reconfigurable mosaic annular arrays; Apertures; Computer architecture; Delay lines; Delays; Microprocessors; Switches; Transducers;
  • fLanguage
    English
  • Journal_Title
    Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-3010
  • Type

    jour

  • DOI
    10.1109/TUFFC.2014.3009
  • Filename
    6838805