Title :
A Ultra Wideband Low Loss CBCPW-to-Microstrip Transition With Multiple Via Holes
Author :
Qi Jiang ; Domier, Calvin ; Luhmann, Neville C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of California, Davis, Davis, CA, USA
Abstract :
A wideband (0 to 26.5 GHz) transition from conductor backed coplanar waveguide (CBCPW) to microstrip line has been developed. Field and impedance transformation have been used in the design; also, via holes were placed on the side ground planes of the CBCPW to suppress the parallel plate resonant mode thereby reducing radiation loss. A back-to-back transition board has been fabricated and tested. The test result shows good agreement with simulation. Under test, the back-to-back design insertion loss is less than 2 dB and the return loss is less than 15 dB from 0 to 26.5 GHz.
Keywords :
coplanar waveguides; microstrip transitions; vias; waveguide transitions; back-to-back design insertion loss; back-to-back transition board; conductor backed coplanar waveguide; frequency 0 GHz to 26.5 GHz; multiple via holes; parallel plate resonant mode suppression; radiation loss reduction; ultrawideband low loss CBCPW-to-microstrip transition; Broadband antennas; Connectors; Coplanar waveguides; Impedance; Insertion loss; Loss measurement; Microstrip; Conductor Backed Coplanar Waveguide (CBCPW); field transformation; impedance transformation; microstrip; transition; via;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2014.2350264
