• DocumentCode
    583979
  • Title

    60 GHz on-chip patch antenna integrated in a 0.18-μm CMOS technology

  • Author

    Hirano, Takuichi ; Okada, Kenichi ; Hirokawa, Jiro ; Ando, Makoto

  • Author_Institution
    Dept. of Int. Dev. Eng., Tokyo Inst. of Technol., Tokyo, Japan
  • fYear
    2012
  • fDate
    Oct. 29 2012-Nov. 2 2012
  • Firstpage
    62
  • Lastpage
    65
  • Abstract
    Millimeter-wave CMOS RF circuits have been received substantial attention, motivated by the advance of CMOS process. In the millimetre-wave band, the connection, such as wire bonding or flip chip bonding, between the RF circuit and off-chip antenna is not easy task because of the radiation loss and/or adding parasitic components. To overcome the problem, on-chip antennas, which do not suffer from the problem of connection, have been studied by many researchers. Accurate and appropriate modelling in simulation is very important to obtain agreement with measurement.
  • Keywords
    CMOS integrated circuits; flip-chip devices; lead bonding; microstrip antennas; millimetre wave antennas; CMOS process; CMOS technology; flip chip bonding; frequency 60 GHz; millimeter-wave CMOS RF circuits; millimetre-wave band; off-chip antenna; on-chip patch antenna; parasitic components; radiation loss; size 0.18 mum; wire bonding; Antenna measurements; CMOS integrated circuits; Frequency measurement; Metals; Patch antennas; Semiconductor device modeling; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation (ISAP), 2012 International Symposium on
  • Conference_Location
    Nagoys
  • Print_ISBN
    978-1-4673-1001-7
  • Type

    conf

  • Filename
    6393851