• DocumentCode
    585274
  • Title

    Integrated analytical and numerical modeling for system level conducted/radiated immunity analysis

  • Author

    Gao, Xian-ke ; Yik, Hou-meng ; Lim, Boon-hui ; Zhao, Huapeng ; Wang, Binfang ; Li, Er-Ping

  • Author_Institution
    Inst. of High Performance Comput., Singapore, Singapore
  • fYear
    2012
  • fDate
    17-21 Sept. 2012
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper presents a system-level modeling method by integrating analytical and numerical methods to analyze conducted and radiated electromagnetic immunity of electronic systems. Through extracting the intrinsic behavioural characteristics from cables, PCBA (board, traces, vias, connectors and components) and enclosure by using the semi-analytical method, one equivalent circuit model is built which is capable of simulating the transient/AC responses and crosstalk under conducted and/or radiated electromagnetic interference. A computer aided modelling system is developed to help industry engineers utilize the proposed methodology for their EMC design.
  • Keywords
    circuit simulation; electromagnetic compatibility; electromagnetic interference; equivalent circuits; integrated circuit modelling; EMC design; PCBA; board; cable; computer aided modelling system; conducted electromagnetic immunity; conducted electromagnetic interference; connector; crosstalk; electronic system; equivalent circuit model; intrinsic behavioural characteristics; radiated electromagnetic immunity; radiated electromagnetic interference; system level conducted/radiated immunity analysis; system-level modeling; transient/AC response simulation; Analytical models; Conductors; Electromagnetic compatibility; Electromagnetic interference; Integrated circuit modeling; Numerical models; Power cables; Conducted Immunity; Conformal Mapping; EMI; Equivalent Circuit; Radiated Immunity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC EUROPE), 2012 International Symposium on
  • Conference_Location
    Rome
  • ISSN
    2325-0356
  • Print_ISBN
    978-1-4673-0718-5
  • Type

    conf

  • DOI
    10.1109/EMCEurope.2012.6396736
  • Filename
    6396736